iPhone X-12 Double-stacked Board Separation & Recombination | REWA Academy Tips

Just Recently, REWA Academy pupils offered comments that the two layers often fail to fit closely in double-stacked motherboard repair service There are even huge gaps, creating pseudo soldering In action, we will share ideas as well as notes when separating and recombining double-stacked motherboard Remove foam on the motherboard prior to heating Please be noted that we do not advise newbies to heat up the motherboard with a warm air weapon Because the motherboard may receive warm unevenly and flaw A specialist motherboard heating platform is what we suggest To help with later elimination of the reasoning board, drive a screw on the reasoning board Cut with the tape with a Sculpture Blade The reasoning board and also center layer are soldered with low-temperature solder paste So the best temperature level for the home heating system will be 155 ° C-165 ° C Press the logic board gently with tweezers when the temperature level reaches 165 ° C If the logic board is loosened, the tin has actually thawed Clamp the screw to get rid of the logic board Remove the signal board Remove thermal grease with a Sculpture Knife Thermal grease need to be removed totally Otherwise, the thermal oil will touch the reasoning board to give rise to pseudo soldering in recombination Affix the signal board to the owner Apply a round of Paste Change Get rid of tin on the bonding pad with Blowpipe at 365 ° C and Solder Wick Tin on the bonding pad should be entirely removed The recurring tin will affect the succeeding soldering Tidy the bonding pad with PCB Cleaner Clean the reasoning board with the very same method Please do not damage components around the bonding pad of the reasoning board while cleaning It is essential to inspect if the bonding pad is cool after cleaning up Connect the signal board to the Reballing Platform Placed the reballing pattern ready to see to it that it is pushing versus the signal board To stop the solder paste from moving right into the motherboard void, insert a steel plate Apply a layer of low-temperature Solder Paste Wipe off excess solder paste with a Lint-free Wipe Eliminate the reballing pattern Inspect if solder paste on the signal board is complete While using solder paste, please make certain that solder paste have to have a specific moisture If the solder paste is as well dry, it will comply with the reballing stencil when the stencil is gotten rid of Therefore, the solder paste on the signal board will not be uniform, which can easily cause inadequate soldering Placed the signal board on the 165 ° C Heating Platform to heat Quit heating after the solder rounds are formed Apply a percentage of Paste Change after the signal board has actually cooled down Align the logic board with the signal board Maintain home heating on the 165 ° C Heating System When the solder flux spills and reasoning board sinks, nudge the logic board carefully with tweezers to make sure both layers fit very closely The nudge needs to be mild as well as little Tidy the motherboard with PCB Cleanser after the motherboard has cooled down If you discover the motherboard flawed while recombining, you can place the motherboard on a flat board and fasten it with a rubber band Press two sides of the motherboard delicately To prevent crushing parts, please put a soft paper under the motherboard Next, we will certainly share an additional recombination technique The method can be taken if the center bonding pad is not damaged When the tin thaws, remove the logic board in a vertical manner with tweezers It can be seen that there is a metal pad of 0.05 mm thickness around the signal board at a specific range This metal pad is designed to keep a 0.05 mm space between the logic board and also the center layer, protecting against the solder spheres from bridging while soldering You only need to remove thermal oil on the motherboard when the repair work is done Maintain original tin on the bonding pad Apply a small quantity of Paste Flux Finally, align the logic board with the signal board When the temperature level reaches 165 ° C as well as the tin thaws, transform the power off Press two ends of the reasoning board with tweezers till the motherboard has cooled The logic board as well as the signal board fit very closely in this way There will be no linking and also solder balls spillover Browse through REWA Academy if you wish to discover more repair work abilities We have complete training course bundles for motherboard medical diagnosis and also fixing ability improvement Click the link in the comment section to acquire motherboard repair service course bundles Thank you for seeing and also do not hesitate to leave a comment

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